Industry News

Multi-laser beam process can also join steel with plate thickness up to 30mm.

Chinese firm set to provide thousands of its lidar sensors, in an exclusive deal said to be worth as much as $300M.

EssilorLuxottica set to acquire an 80% shareholding in Heidelberg Engineering.

Researchers from Purdue University have developed a robust optical anticounterfeit method for semiconductor devices.

Grant from Israel Innovation Authority assists commercialization of spectrographic platform.

Preliminary figures indicate near-10% fall in order intake for second year in succession.

Stock price drops from all-time high on speculation of new restrictions to activity in China.

…while Vanderbilt develops laser-based method for “liquid biopsies”.

Centre for Nanosciences & Nanotech, France, Télécom Paris, and STMicro have “overcome previous limitations”.

Firms co-developing smart chips and software to improve welding, cutting and marking.